II.
SkillArea JSON
Structured · liveskill-area:hardware-abstraction-layer
Hardware Abstraction Layer Design json
Inspect the normalized record payload exactly as the atlas UI reads it.
{
"id": "skill-area:hardware-abstraction-layer",
"_kind": "SkillArea",
"_file": "domain/skill-areas/skill-areas-embedded-fpga.yaml",
"_cluster": "domain",
"attributes": {
"displayName": "Hardware Abstraction Layer Design",
"description": "Designing HALs over MCU peripherals — portable APIs, register\nmaps, and vendor-SDK isolation.\n",
"domains": [
"specialization:embedded-systems"
],
"expertiseLevels": [
"intermediate",
"expert"
]
},
"outgoingEdges": [
{
"from": "skill-area:hardware-abstraction-layer",
"to": "specialization:embedded-systems",
"kind": "applies_to",
"attributes": {
"confidence": "primary"
}
}
],
"incomingEdges": [
{
"from": "skill-area:firmware-development",
"to": "skill-area:hardware-abstraction-layer",
"kind": "prerequisite_for_learning",
"attributes": {
"strength": "recommended"
}
},
{
"from": "specialization:embedded-firmware",
"to": "skill-area:hardware-abstraction-layer",
"kind": "contains"
},
{
"from": "stack-profile:embedded-linux",
"to": "skill-area:hardware-abstraction-layer",
"kind": "requires_skill_area"
},
{
"from": "lib-agent:electrical-engineering--hardware-validation-engineer",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-agent:electrical-engineering--reliability-engineer",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-agent:electrical-engineering--test-measurement-expert",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--analog-circuit-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--arc-flash-analysis",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--bms-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--communication-system-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--dfm-review",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--digital-filter-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--digital-logic-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--dsp-algorithm-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--emc-design-testing",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--environmental-testing",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--feedback-control-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--hardware-validation",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--highspeed-pcb-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--mixed-signal-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--motion-control-development",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--motor-drive-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--mpc-implementation",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--power-flow-analysis",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--protection-coordination",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--renewable-integration",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--switching-power-supply-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-skill:electrical-engineering--reliability-analysis",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-skill:electrical-engineering--test-automation",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-skill:electrical-engineering--thermal-analysis",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "workflow:avionics-integration-testing",
"to": "skill-area:hardware-abstraction-layer",
"kind": "requires_skill_area",
"attributes": {}
},
{
"from": "workflow:pcb-design-review",
"to": "skill-area:hardware-abstraction-layer",
"kind": "requires_skill_area",
"attributes": {}
},
{
"from": "workflow:signal-integrity-analysis",
"to": "skill-area:hardware-abstraction-layer",
"kind": "requires_skill_area",
"attributes": {}
}
]
}