iiRecord
Agentic AI Atlas · highspeed-pcb-design
lib-process:electrical-engineering--highspeed-pcb-designa5c.ai
II.
LibraryProcess JSON

lib-process:electrical-engineering--highspeed-pcb-design

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highspeed-pcb-design json

Inspect the normalized record payload exactly as the atlas UI reads it.

File · generated-library/processes.yamlCluster · generated-library
Record JSON
{
  "id": "lib-process:electrical-engineering--highspeed-pcb-design",
  "_kind": "LibraryProcess",
  "_file": "generated-library/processes.yaml",
  "_cluster": "generated-library",
  "attributes": {
    "displayName": "highspeed-pcb-design",
    "description": "High-Speed PCB Design - Guide the design of PCBs for high-speed digital applications. Covers stack-up\ndesign, impedance control, signal integrity, and power integrity considerations.",
    "libraryPath": "library/specializations/domains/science/electrical-engineering/highspeed-pcb-design.js",
    "specialization": "electrical-engineering",
    "references": [
      "- IPC-2221 (Generic Standard on Printed Board Design)\n- IPC-2223 (Sectional Design Standard for Flexible Printed Boards)\n- IEEE Signal Integrity Guidelines\n- JEDEC Memory Interface Standards"
    ],
    "example": "const result = await orchestrate('specializations/domains/science/electrical-engineering/highspeed-pcb-design', {\n  boardName: 'DDR4 Memory Interface',\n  signalRequirements: { dataRate: '3200MT/s', impedance: { single: '50ohm', diff: '100ohm' } },\n  powerRequirements: { rails: ['1.2V', '3.3V'], ripple: '<50mV' },\n  constraints: { layers: 8, boardSize: '100x80mm' }\n});",
    "usesAgents": [
      "signal-integrity-engineer"
    ]
  },
  "outgoingEdges": [
    {
      "from": "lib-process:electrical-engineering--highspeed-pcb-design",
      "to": "skill-area:hardware-abstraction-layer",
      "kind": "lib_requires_skill_area",
      "attributes": {
        "weight": 1
      }
    },
    {
      "from": "lib-process:electrical-engineering--highspeed-pcb-design",
      "to": "skill-area:device-drivers",
      "kind": "lib_requires_skill_area",
      "attributes": {
        "weight": 0.7
      }
    },
    {
      "from": "lib-process:electrical-engineering--highspeed-pcb-design",
      "to": "skill-area:firmware-development",
      "kind": "lib_requires_skill_area",
      "attributes": {
        "weight": 0.5
      }
    },
    {
      "from": "lib-process:electrical-engineering--highspeed-pcb-design",
      "to": "domain:electrical-engineering",
      "kind": "lib_applies_to_domain",
      "attributes": {
        "weight": 1
      }
    },
    {
      "from": "lib-process:electrical-engineering--highspeed-pcb-design",
      "to": "role:embedded-engineer",
      "kind": "lib_involves_role",
      "attributes": {
        "weight": 1
      }
    },
    {
      "from": "lib-process:electrical-engineering--highspeed-pcb-design",
      "to": "role:systems-integration-engineer",
      "kind": "lib_involves_role",
      "attributes": {
        "weight": 0.7
      }
    },
    {
      "from": "lib-process:electrical-engineering--highspeed-pcb-design",
      "to": "workflow:architecture-decision-record",
      "kind": "lib_implements_workflow",
      "attributes": {
        "weight": 1
      }
    },
    {
      "from": "lib-process:electrical-engineering--highspeed-pcb-design",
      "to": "specialization:electrical-engineering",
      "kind": "lib_belongs_to_specialization",
      "attributes": {
        "weight": 0.9
      }
    }
  ],
  "incomingEdges": []
}