II.
LibraryProcess JSON
Structured · livelib-process:electrical-engineering--highspeed-pcb-design
highspeed-pcb-design json
Inspect the normalized record payload exactly as the atlas UI reads it.
{
"id": "lib-process:electrical-engineering--highspeed-pcb-design",
"_kind": "LibraryProcess",
"_file": "generated-library/processes.yaml",
"_cluster": "generated-library",
"attributes": {
"displayName": "highspeed-pcb-design",
"description": "High-Speed PCB Design - Guide the design of PCBs for high-speed digital applications. Covers stack-up\ndesign, impedance control, signal integrity, and power integrity considerations.",
"libraryPath": "library/specializations/domains/science/electrical-engineering/highspeed-pcb-design.js",
"specialization": "electrical-engineering",
"references": [
"- IPC-2221 (Generic Standard on Printed Board Design)\n- IPC-2223 (Sectional Design Standard for Flexible Printed Boards)\n- IEEE Signal Integrity Guidelines\n- JEDEC Memory Interface Standards"
],
"example": "const result = await orchestrate('specializations/domains/science/electrical-engineering/highspeed-pcb-design', {\n boardName: 'DDR4 Memory Interface',\n signalRequirements: { dataRate: '3200MT/s', impedance: { single: '50ohm', diff: '100ohm' } },\n powerRequirements: { rails: ['1.2V', '3.3V'], ripple: '<50mV' },\n constraints: { layers: 8, boardSize: '100x80mm' }\n});",
"usesAgents": [
"signal-integrity-engineer"
]
},
"outgoingEdges": [
{
"from": "lib-process:electrical-engineering--highspeed-pcb-design",
"to": "skill-area:hardware-abstraction-layer",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--highspeed-pcb-design",
"to": "skill-area:device-drivers",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 0.7
}
},
{
"from": "lib-process:electrical-engineering--highspeed-pcb-design",
"to": "skill-area:firmware-development",
"kind": "lib_requires_skill_area",
"attributes": {
"weight": 0.5
}
},
{
"from": "lib-process:electrical-engineering--highspeed-pcb-design",
"to": "domain:electrical-engineering",
"kind": "lib_applies_to_domain",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--highspeed-pcb-design",
"to": "role:embedded-engineer",
"kind": "lib_involves_role",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--highspeed-pcb-design",
"to": "role:systems-integration-engineer",
"kind": "lib_involves_role",
"attributes": {
"weight": 0.7
}
},
{
"from": "lib-process:electrical-engineering--highspeed-pcb-design",
"to": "workflow:architecture-decision-record",
"kind": "lib_implements_workflow",
"attributes": {
"weight": 1
}
},
{
"from": "lib-process:electrical-engineering--highspeed-pcb-design",
"to": "specialization:electrical-engineering",
"kind": "lib_belongs_to_specialization",
"attributes": {
"weight": 0.9
}
}
],
"incomingEdges": []
}